IL C3200 Datasheet Access

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  IL C3200

  • Split, merge and sort 300mm wafers
  • Up to 3 automatic FOUP Loadports
  • ISO 3 minienvironment (ISO 14644-1)
  • Suitable for PGV, AGV and OHT loading
  • Can be used as a wafer transfer module in comparison with a measurement or inspection tool (EFEM)

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