Laser Cutting 2D Organics

with Universal Laser Systems

Universal has a focus on R&D to provide new terchnologies that deliver productivity and reliability at competitive process. Rather than cobble together available technlogies original patented hardware is produced to offer more than 1,000,000 different possible configurations that enable the cutting of a hugely broad range of materials.

Modular Architecture
ULS Laser Sources
Rapid Reconfiguration^™
Laser System User Interfaces
Intelligent Materials Database
Dual Laser Configuration
MultiWave Hybrid^™Technology
SuperSpeed^™ Technology
HPDFO^™ (High Power Density Focusing Optics)
Gas Assist with Optics Protection

Cutting Tables
Air Filtration Units
Class 4 Conversion Module
Traveling Exhaust
1-Touch Laser Photo^™
Direct File Import
Universal Camera Registration
Automation Interface
Non-Contact Hydrostatic Fluid Bearings
Fire Suppression
Embedded PC

ULTRA X6000

Laser Cutting, Engraving and Marking
The ULTRA X6000 platform offers laser material processing for the widest possible range of materials. It is designed and ideally suited for precision material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs. The ULTRA X6000 platform has a materials processing envelope of 36 x 24 in (914 x 610 mm), with support for materials with a thickness up to 12 in (305 mm)....

ULTRA X6000 »
ULTRA R9000

Laser processing for a wide range of materials
The ULTRA R9000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs. The ULTRA R9000 platform has a materials processing envelope of 48 x 24 in (1219 x 610 mm), with support for materials with a thickness up to 12 in (305 mm)....

ULTRA R9000 »
ULTRA R5000

For laser cutting and material processing in manufacturing
The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs. The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610 mm), with support for materials with a thickness up to 12 in (305 mm)....

ULTRA R5000 »
VLS2.30DT

Compact entry level cutting and marking platform
The VLS2.30DT Desktop is a compact and economical entry level platform. It offers a material processing envelope of 16" x 12" x 4" or 768 in³ (406 x 305 x 102 mm or 12,585 cm³) and can be equipped with one 10.6µm CO2 laser source ranging in power from 10 to 30 watts or one 9.3µm CO2 30 watt laser source....

VLS2.30DT »
VLS3.60DT

Compact and Economical Laser Cutting and Processing Platform
The VLS3.60DT is a compact and economical entry level platform that offers a material processing envelope of 24" x 12" x 4" or 1,152 in³ (610 x 305 x 102 mm or 18,878 cm³). The VLS3.60DT can be equipped with one of five 10.6µm CO2 laser sources ranging in power from 10 to 60 watts or one 9.3µm CO2 30 watt or 50 watt laser source....

VLS3.60DT »
VLS3.75

Free-standing Laser Cuting and Marking Platform
The VLS3.75 is a free-standing platform with a materials processing envelope of 24" x 12" x 8.5" or 2,448 in³ (610 x 305 x 216 mm or 40,187 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source....

VLS3.75 »
VLS4.75

Free-standing Laser Cutting and Engraving Platform
The VLS4.75 is a free-standing platform with a materials processing envelope of 24" x 18" x 8.5" or 3,672 in³ (610 x 457 x 216 mm or 60,214 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source....

VLS4.75 »
VLS6.75

Free-standing Laser Cutting and Marking Platform
The VLS6.75 is a free-standing platform with a material processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³). The single laser platform supports a 10.6µm CO2 laser source ranging in power from 10 to 75 watts or one 9.3µm CO2 30 watt, 50 watt, or 75 watt laser source....

VLS6.75 »
PLS6.150D

Dual Laser Cutting and Marking Platform
The PLS6.150D is a free-standing platform with a materials processing envelope of 32" x 18" x 8.5" or 4,896 in³ (813 x 457 x 216 mm or 80,253 cm³) that supports dual lasers. As a dual laser platform, the PLS6.150 can support up to two 10.6µm CO2 lasers with a power range of 10 watts to 150 watts. Additionally, it can support a single 9.3µm CO2 of 30, 50 or 75 watts. (if a 9.3µm CO2 laser is installed, only one 10.6µm CO2 of up to 75 watts may be installed at the same time.)...

PLS6.150D »

If you need more information on any of these laser machines or you would like help integrating them into your production environment, please contact us

Laser Cutting 2D Organics

with Universal Laser Systems

ULTRA X6000

ULTRA R9000

ULTRA R5000

VLS2.30DT

VLS3.60DT

VLS3.75

VLS4.75

VLS6.75

PLS6.150D