Laser Systems

WorkStationXY

The WorkStationXY is an ultra-precise laser cutting system for large sheet materials. Designed for electronic and medical industries, it supports configure-to-order options, including fibre, UV, and CO2 lasers, for highly accurate part processing.

Laser Type

IR (Co2 & Fibre)

The WorkStationXY supports IR laser options, including CO2 lasers at 10.6 µm and fibre lasers at 1060 nm. These IR lasers provide high-speed, precise cutting and scoring capabilities for electronic and medical applications.

UV (Solid State)

The system also supports UV solid-state lasers operating at 355 nm, ideal for intricate, high-contrast applications requiring minimal heat impact on delicate materials, such as thin films and sensitive electronic components.

Laser Systems

Packaging & Converting Laser Systems

The WorkStationXY is an advanced laser cutting platform engineered for processing large sheet materials into finished parts for the electronic and medical industries. Featuring two high-speed linear motors, the system ensures ultra-precise X-Y positioning and consistent laser processing across the entire sheet. Its configure-to-order design supports a range of laser modules, including fibre, ultraviolet, and CO2 options, with power levels tailored to specific application needs. Automated features such as part registration, distortion compensation, sheet loading, and part unloading enhance throughput and efficiency. Ideal for applications requiring high precision and reliability, the WorkStationXY delivers exceptional results for intricate electronic components and medical devices, while its modular design ensures seamless integration into advanced production environments.

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Frequently Asked Questions

How do laser marking and wafer sorting contribute to quality assurance in semiconductor manufacturing?

Both laser marking and wafer sorting are integral to maintaining high-quality standards in semiconductor production. Laser marking provides permanent identification of each component, enabling traceability and facilitating the tracking of products throughout their lifecycle. Wafer sorting ensures that only functional dies advance to the packaging stage, effectively filtering out defective units early in the process. Together, these processes help minimise errors, reduce waste, and ensure that only components meeting strict quality criteria reach the market. 

What is wafer sorting, and what role does it play in semiconductor manufacturing?

Wafer sorting, also known as wafer testing, is a process performed during semiconductor fabrication where each die (individual chip) on a silicon wafer is electrically tested for functionality. The primary purpose of wafer sorting is to identify non-functional or defective dies before they proceed to packaging, thereby preventing the assembly of faulty components. This step is crucial for enhancing overall yield, reducing manufacturing costs, and ensuring the reliability of semiconductor devices. 

What is laser marking, and why is it important in the semiconductor industry?

Laser marking is a process that uses focused laser beams to create precise, permanent marks on materials. In the semiconductor industry, this technique is essential for inscribing critical information onto wafers. The high precision of laser marking ensures that even microscopic marks are clear and readable, facilitating effective traceability and quality control throughout the manufacturing process.

What industries and applications are ideal for the AL3D?

The AL3D-METAL 200 is particularly suited for industries requiring high precision and intricate designs, such as precision mechanics, medical technology, dental, and jewellery sectors, as well as research and development laboratories. Its ability to produce complex geometries with fine detail makes it ideal for creating customised components, prototypes, and small series productions. The printer’s efficient material usage and safe powder handling are advantageous when working with high-value materials, making it a valuable tool for producing high-quality metal parts across various applications. 

How does the AL3D ensure safe and efficient powder handling?

The AL3D-METAL 200 features a closed powder circuit that prevents operator contact with metal powders during the entire printing process, enhancing workplace safety. Its intelligent cartridge system simplifies material supply, enables quick process preparation, and ensures high material utilisation, which is particularly beneficial when working with expensive or precious metals. Additionally, the system includes the AL3D-CABIN unpacking station, providing a closed process chamber for the safe separation of sintered components from residual powder and facilitating the collection and potential reuse of leftover material. 

What is the AL3D-METAL, and what are its key features?

The AL3D-METAL 200 is a 3D metal printer developed by ALPHA LASER GmbH, designed for the additive manufacturing of high-precision metal components. Key features include a 200 W fibre laser with a 50 µm focus diameter, a closed powder handling system for enhanced safety, an innovative cartridge system for efficient material usage, and a compact footprint of 600 × 617 mm, making it suitable for environments with limited space. The printer supports a variety of materials, including iron alloys, nickel-based alloys, cobalt-chrome alloys, precious metals, and reactive metals. 

What materials are suitable for laser hardening, and what applications benefit from this process?

Laser hardening is primarily applied to ferrous metals, including various steels and cast irons, that have sufficient carbon content to undergo martensitic transformation. Industries such as automotive, aerospace and mechanical engineering utilise laser hardening to enhance the wear resistance and lifespan of components like gears, camshafts, and moulds. The process is particularly advantageous for large or complex parts, as mobile laser hardening systems can treat these components in situ, reducing downtime and eliminating the need for disassembly. 

What are the advantages of laser hardening over traditional hardening methods?

Laser hardening offers several benefits compared to conventional techniques:

  • Precision and Control: The laser allows for exact control over the area being hardened, enabling selective treatment of specific surfaces without affecting the entire component.
  • Minimal Distortion: Due to localised heating and rapid self-quenching, there is reduced thermal distortion, preserving the component’s dimensional accuracy.
  • No Need for External Quenching: The process utilises the material’s own mass to cool the heated area, eliminating the requirement for external quenching media like water or oil.
  • Efficiency: Laser hardening is a fast process, often completed in seconds, leading to significant time and energy savings. 
What is laser hardening, and how does it work?

Laser hardening is a surface treatment process that uses a high-powered laser beam to heat the surface layer of a metal component to its austenitizing temperature. This rapid, localised heating is followed by self-quenching, where the surrounding material cools the heated area quickly, transforming it into martensite—a hard and wear-resistant microstructure. This method enhances the surface hardness and durability of metal parts without the need for external quenching media. 

What materials can be used in laser cladding?

Laser Cladding can be used for metals Such as stainless steel, nickel-based alloys, cobalt-based alloys, and titanium.

Don't Just Take Our Word for It

TLM Laser provided an exceptional service from start to finish—professional, efficient, and delivered exactly what we needed.

KEITH WALTERS
K.W. PROPERTY SERVICES

Very knowledgeable, professional company. They have been maintaining our laser systems for years.

BRIAN DAVIDSON
SHIN-ETSU HANDOTAI EUROPE LTD

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