Laser Systems
VLS-6.75
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The VLS 6.75 from Universal Laser Systems is a free-standing CO2 laser platform with a 32 x 18-inch processing area. Supporting laser power up to 75W, it offers precision cutting, engraving, and marking for industrial and creative applications.
Laser Type
The VLS 6.75 is equipped with CO2 lasers operating at wavelengths of 10.6 µm and 9.3 µm. Laser power options range from 10W to 75W, ensuring precision cutting, engraving, and marking on various materials. The system’s advanced optics and processing capabilities deliver consistent, high-quality results for industrial and creative applications.
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Laser Systems
Laser Cutting
The VLS 6.75 by Universal Laser Systems is a robust CO2 laser platform designed for cutting, engraving, and marking a wide range of materials, including wood, plastics, and coated metals. Featuring a large 32 x 18-inch (813 x 457 mm) processing area, it supports laser power options from 10W to 75W at a wavelength of 10.6 µm, with additional options of 30W, 50W, and 75W at 9.3 µm. Advanced features like Rapid Reconfiguration™ allow users to easily swap laser sources for different applications, while the Universal Control Panel (UCP) simplifies operation with its materials database and automated settings. Optional accessories, such as High Power Density Focusing Optics (HPDFO™), enhance engraving precision, and 1-Touch Laser Photo™ allows for high-quality image reproduction. With its free-standing design and advanced capabilities, the VLS 6.75 is ideal for production environments, educational settings, and creative workshops.
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Frequently Asked Questions
Both laser marking and wafer sorting are integral to maintaining high-quality standards in semiconductor production. Laser marking provides permanent identification of each component, enabling traceability and facilitating the tracking of products throughout their lifecycle. Wafer sorting ensures that only functional dies advance to the packaging stage, effectively filtering out defective units early in the process. Together, these processes help minimise errors, reduce waste, and ensure that only components meeting strict quality criteria reach the market.
Wafer sorting, also known as wafer testing, is a process performed during semiconductor fabrication where each die (individual chip) on a silicon wafer is electrically tested for functionality. The primary purpose of wafer sorting is to identify non-functional or defective dies before they proceed to packaging, thereby preventing the assembly of faulty components. This step is crucial for enhancing overall yield, reducing manufacturing costs, and ensuring the reliability of semiconductor devices.
Laser marking is a process that uses focused laser beams to create precise, permanent marks on materials. In the semiconductor industry, this technique is essential for inscribing critical information onto wafers. The high precision of laser marking ensures that even microscopic marks are clear and readable, facilitating effective traceability and quality control throughout the manufacturing process.
The AL3D-METAL 200 is particularly suited for industries requiring high precision and intricate designs, such as precision mechanics, medical technology, dental, and jewellery sectors, as well as research and development laboratories. Its ability to produce complex geometries with fine detail makes it ideal for creating customised components, prototypes, and small series productions. The printer’s efficient material usage and safe powder handling are advantageous when working with high-value materials, making it a valuable tool for producing high-quality metal parts across various applications.
The AL3D-METAL 200 features a closed powder circuit that prevents operator contact with metal powders during the entire printing process, enhancing workplace safety. Its intelligent cartridge system simplifies material supply, enables quick process preparation, and ensures high material utilisation, which is particularly beneficial when working with expensive or precious metals. Additionally, the system includes the AL3D-CABIN unpacking station, providing a closed process chamber for the safe separation of sintered components from residual powder and facilitating the collection and potential reuse of leftover material.
The AL3D-METAL 200 is a 3D metal printer developed by ALPHA LASER GmbH, designed for the additive manufacturing of high-precision metal components. Key features include a 200 W fibre laser with a 50 µm focus diameter, a closed powder handling system for enhanced safety, an innovative cartridge system for efficient material usage, and a compact footprint of 600 × 617 mm, making it suitable for environments with limited space. The printer supports a variety of materials, including iron alloys, nickel-based alloys, cobalt-chrome alloys, precious metals, and reactive metals.
Laser hardening is primarily applied to ferrous metals, including various steels and cast irons, that have sufficient carbon content to undergo martensitic transformation. Industries such as automotive, aerospace and mechanical engineering utilise laser hardening to enhance the wear resistance and lifespan of components like gears, camshafts, and moulds. The process is particularly advantageous for large or complex parts, as mobile laser hardening systems can treat these components in situ, reducing downtime and eliminating the need for disassembly.
Laser hardening offers several benefits compared to conventional techniques:
- Precision and Control: The laser allows for exact control over the area being hardened, enabling selective treatment of specific surfaces without affecting the entire component.
- Minimal Distortion: Due to localised heating and rapid self-quenching, there is reduced thermal distortion, preserving the component’s dimensional accuracy.
- No Need for External Quenching: The process utilises the material’s own mass to cool the heated area, eliminating the requirement for external quenching media like water or oil.
- Efficiency: Laser hardening is a fast process, often completed in seconds, leading to significant time and energy savings.
Laser hardening is a surface treatment process that uses a high-powered laser beam to heat the surface layer of a metal component to its austenitizing temperature. This rapid, localised heating is followed by self-quenching, where the surrounding material cools the heated area quickly, transforming it into martensite—a hard and wear-resistant microstructure. This method enhances the surface hardness and durability of metal parts without the need for external quenching media.
Laser Cladding can be used for metals Such as stainless steel, nickel-based alloys, cobalt-based alloys, and titanium.
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