Laser Systems

VLS-3.75

The VLS 3.75 from Universal Laser Systems is a free-standing CO2 laser platform with a 24 x 12-inch processing area. Supporting laser power up to 75W, it is ideal for cutting, engraving, and marking in diverse industrial and creative applications.

Laser Type

IR (Co2)

The VLS 3.75 operates with CO2 lasers at wavelengths of 10.6 µm and 9.3 µm. Laser power options range from 10W to 75W, enabling precision cutting, engraving, and marking on materials such as plastics, wood, and coated metals. Advanced optics ensure consistent beam quality and processing efficiency.

Laser Systems

Laser Cutting

The VLS 3.75 by Universal Laser Systems is a robust and versatile laser platform designed for cutting, engraving, and marking on a wide range of materials. It features a 24 x 12-inch (610 x 305 mm) processing area and offers laser power options from 10W to 75W at a wavelength of 10.6 µm or 30W, 50W, and 75W at 9.3 µm. With advanced features like Rapid Reconfiguration™, users can easily swap laser sources to meet specific processing needs. The system integrates Universal’s exclusive materials database via the Universal Control Panel (UCP) for automated optimisation of laser settings. Optional accessories include High Power Density Focusing Optics (HPDFO™) for fine engraving and 1-Touch Laser Photo™ for high-quality image reproduction. Its compact footprint and robust capabilities make it suitable for industrial, educational, and creative environments.

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Frequently Asked Questions

How do laser marking and wafer sorting contribute to quality assurance in semiconductor manufacturing?

Both laser marking and wafer sorting are integral to maintaining high-quality standards in semiconductor production. Laser marking provides permanent identification of each component, enabling traceability and facilitating the tracking of products throughout their lifecycle. Wafer sorting ensures that only functional dies advance to the packaging stage, effectively filtering out defective units early in the process. Together, these processes help minimise errors, reduce waste, and ensure that only components meeting strict quality criteria reach the market. 

What is wafer sorting, and what role does it play in semiconductor manufacturing?

Wafer sorting, also known as wafer testing, is a process performed during semiconductor fabrication where each die (individual chip) on a silicon wafer is electrically tested for functionality. The primary purpose of wafer sorting is to identify non-functional or defective dies before they proceed to packaging, thereby preventing the assembly of faulty components. This step is crucial for enhancing overall yield, reducing manufacturing costs, and ensuring the reliability of semiconductor devices. 

What is laser marking, and why is it important in the semiconductor industry?

Laser marking is a process that uses focused laser beams to create precise, permanent marks on materials. In the semiconductor industry, this technique is essential for inscribing critical information onto wafers. The high precision of laser marking ensures that even microscopic marks are clear and readable, facilitating effective traceability and quality control throughout the manufacturing process.

What industries and applications are ideal for the AL3D?

The AL3D-METAL 200 is particularly suited for industries requiring high precision and intricate designs, such as precision mechanics, medical technology, dental, and jewellery sectors, as well as research and development laboratories. Its ability to produce complex geometries with fine detail makes it ideal for creating customised components, prototypes, and small series productions. The printer’s efficient material usage and safe powder handling are advantageous when working with high-value materials, making it a valuable tool for producing high-quality metal parts across various applications. 

How does the AL3D ensure safe and efficient powder handling?

The AL3D-METAL 200 features a closed powder circuit that prevents operator contact with metal powders during the entire printing process, enhancing workplace safety. Its intelligent cartridge system simplifies material supply, enables quick process preparation, and ensures high material utilisation, which is particularly beneficial when working with expensive or precious metals. Additionally, the system includes the AL3D-CABIN unpacking station, providing a closed process chamber for the safe separation of sintered components from residual powder and facilitating the collection and potential reuse of leftover material. 

What is the AL3D-METAL, and what are its key features?

The AL3D-METAL 200 is a 3D metal printer developed by ALPHA LASER GmbH, designed for the additive manufacturing of high-precision metal components. Key features include a 200 W fibre laser with a 50 µm focus diameter, a closed powder handling system for enhanced safety, an innovative cartridge system for efficient material usage, and a compact footprint of 600 × 617 mm, making it suitable for environments with limited space. The printer supports a variety of materials, including iron alloys, nickel-based alloys, cobalt-chrome alloys, precious metals, and reactive metals. 

What materials are suitable for laser hardening, and what applications benefit from this process?

Laser hardening is primarily applied to ferrous metals, including various steels and cast irons, that have sufficient carbon content to undergo martensitic transformation. Industries such as automotive, aerospace and mechanical engineering utilise laser hardening to enhance the wear resistance and lifespan of components like gears, camshafts, and moulds. The process is particularly advantageous for large or complex parts, as mobile laser hardening systems can treat these components in situ, reducing downtime and eliminating the need for disassembly. 

What are the advantages of laser hardening over traditional hardening methods?

Laser hardening offers several benefits compared to conventional techniques:

  • Precision and Control: The laser allows for exact control over the area being hardened, enabling selective treatment of specific surfaces without affecting the entire component.
  • Minimal Distortion: Due to localised heating and rapid self-quenching, there is reduced thermal distortion, preserving the component’s dimensional accuracy.
  • No Need for External Quenching: The process utilises the material’s own mass to cool the heated area, eliminating the requirement for external quenching media like water or oil.
  • Efficiency: Laser hardening is a fast process, often completed in seconds, leading to significant time and energy savings. 
What is laser hardening, and how does it work?

Laser hardening is a surface treatment process that uses a high-powered laser beam to heat the surface layer of a metal component to its austenitizing temperature. This rapid, localised heating is followed by self-quenching, where the surrounding material cools the heated area quickly, transforming it into martensite—a hard and wear-resistant microstructure. This method enhances the surface hardness and durability of metal parts without the need for external quenching media. 

What materials can be used in laser cladding?

Laser Cladding can be used for metals Such as stainless steel, nickel-based alloys, cobalt-based alloys, and titanium.

Don't Just Take Our Word for It

TLM Laser provided an exceptional service from start to finish—professional, efficient, and delivered exactly what we needed.

KEITH WALTERS
K.W. PROPERTY SERVICES

Very knowledgeable, professional company. They have been maintaining our laser systems for years.

BRIAN DAVIDSON
SHIN-ETSU HANDOTAI EUROPE LTD

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