Laser Systems
FOBA M2000
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The FOBA M2000 is a versatile laser marking workstation designed for high-precision marking of small to large components. Available in three configurations, it features advanced automation options, vision inspection, and compatibility with fibre, UV, and green laser technologies for superior traceability and product marking.
Models
The M2000-B is equipped with a worktable, a programmable Z-axis, and an electric lift door. It is ideal for standard part marking applications, providing reliable results for industries requiring traceability and compliance.
The M2000-P features programmable X, Y, and Z axes, making it suitable for batch marking and complex marking tasks on trays or large parts. Its advanced automation capabilities improve throughput and marking consistency.
The M2000-R is designed for high-throughput applications, featuring a two-station rotary table for continuous marking of serial components. It is ideal for industries with repetitive marking tasks, such as automotive and medical device manufacturing.
Laser Type
The M2000 is compatible with FOBA’s Y Series IR fibre lasers, ranging from 20 Watt to 50 Watt, offering precise, high-contrast marking on metals and some plastics. For applications requiring ultra-black, non-reflective markings with minimal heat impact, the F.0100-ir Ultra Short Pulsed Laser is an ideal choice. It ensures deep black, corrosion-resistant marks, making it suitable for medical devices and sensitive materials.
FOBA’s 4 Watt UV laser, part of their V Series range, is ideal for delicate materials, providing fine, high-contrast markings with minimal heat impact. This makes it perfect for medical devices, plastics, and sensitive electronic components.
FOBA’s 10 Watt Green laser, part of their V Series range, delivers sharp, high-contrast markings on a range of materials, including metals and plastics. Its low thermal impact ensures precise results for components in aerospace, medical, and automotive industries.
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Laser Systems
Laser Marking & Engraving
The FOBA M2000 laser marking workstation offers precision, flexibility, and productivity for a range of industrial marking applications. Available in three models (B, P, R), it caters to different production needs, from standard part marking to batch processing and rotary marking. Designed with a robust polymer concrete structure, it ensures vibration-free operation for consistently high marking quality. The M2000 is compatible with fibre, UV, and green lasers, providing permanent, high-contrast results on materials such as metals and plastics. Advanced features include a programmable Z-axis, optional multi-axis configurations, and integrated vision inspection for error-free marking and reduced waste. Its ergonomic design, electric lift door, and optional rotary table make it ideal for industries such as automotive, medical, and aerospace, where precision and compliance are critical.
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Frequently Asked Questions
Both laser marking and wafer sorting are integral to maintaining high-quality standards in semiconductor production. Laser marking provides permanent identification of each component, enabling traceability and facilitating the tracking of products throughout their lifecycle. Wafer sorting ensures that only functional dies advance to the packaging stage, effectively filtering out defective units early in the process. Together, these processes help minimise errors, reduce waste, and ensure that only components meeting strict quality criteria reach the market.
Wafer sorting, also known as wafer testing, is a process performed during semiconductor fabrication where each die (individual chip) on a silicon wafer is electrically tested for functionality. The primary purpose of wafer sorting is to identify non-functional or defective dies before they proceed to packaging, thereby preventing the assembly of faulty components. This step is crucial for enhancing overall yield, reducing manufacturing costs, and ensuring the reliability of semiconductor devices.
Laser marking is a process that uses focused laser beams to create precise, permanent marks on materials. In the semiconductor industry, this technique is essential for inscribing critical information onto wafers. The high precision of laser marking ensures that even microscopic marks are clear and readable, facilitating effective traceability and quality control throughout the manufacturing process.
The AL3D-METAL 200 is particularly suited for industries requiring high precision and intricate designs, such as precision mechanics, medical technology, dental, and jewellery sectors, as well as research and development laboratories. Its ability to produce complex geometries with fine detail makes it ideal for creating customised components, prototypes, and small series productions. The printer’s efficient material usage and safe powder handling are advantageous when working with high-value materials, making it a valuable tool for producing high-quality metal parts across various applications.
The AL3D-METAL 200 features a closed powder circuit that prevents operator contact with metal powders during the entire printing process, enhancing workplace safety. Its intelligent cartridge system simplifies material supply, enables quick process preparation, and ensures high material utilisation, which is particularly beneficial when working with expensive or precious metals. Additionally, the system includes the AL3D-CABIN unpacking station, providing a closed process chamber for the safe separation of sintered components from residual powder and facilitating the collection and potential reuse of leftover material.
The AL3D-METAL 200 is a 3D metal printer developed by ALPHA LASER GmbH, designed for the additive manufacturing of high-precision metal components. Key features include a 200 W fibre laser with a 50 µm focus diameter, a closed powder handling system for enhanced safety, an innovative cartridge system for efficient material usage, and a compact footprint of 600 × 617 mm, making it suitable for environments with limited space. The printer supports a variety of materials, including iron alloys, nickel-based alloys, cobalt-chrome alloys, precious metals, and reactive metals.
Laser hardening is primarily applied to ferrous metals, including various steels and cast irons, that have sufficient carbon content to undergo martensitic transformation. Industries such as automotive, aerospace and mechanical engineering utilise laser hardening to enhance the wear resistance and lifespan of components like gears, camshafts, and moulds. The process is particularly advantageous for large or complex parts, as mobile laser hardening systems can treat these components in situ, reducing downtime and eliminating the need for disassembly.
Laser hardening offers several benefits compared to conventional techniques:
- Precision and Control: The laser allows for exact control over the area being hardened, enabling selective treatment of specific surfaces without affecting the entire component.
- Minimal Distortion: Due to localised heating and rapid self-quenching, there is reduced thermal distortion, preserving the component’s dimensional accuracy.
- No Need for External Quenching: The process utilises the material’s own mass to cool the heated area, eliminating the requirement for external quenching media like water or oil.
- Efficiency: Laser hardening is a fast process, often completed in seconds, leading to significant time and energy savings.
Laser hardening is a surface treatment process that uses a high-powered laser beam to heat the surface layer of a metal component to its austenitizing temperature. This rapid, localised heating is followed by self-quenching, where the surrounding material cools the heated area quickly, transforming it into martensite—a hard and wear-resistant microstructure. This method enhances the surface hardness and durability of metal parts without the need for external quenching media.
Laser Cladding can be used for metals Such as stainless steel, nickel-based alloys, cobalt-based alloys, and titanium.
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